MEIX HPK-400 Formic Acid Reflow Soldering Oven, This machine perfectly matches PINK vacuum reflow soldering, has independent intellectual property rights, and is designed for high-power modules such as semiconductor power devices and IGBTs.

This equipment adopts an industrial embedded control system, which uses dual CPU operations, not only stable and reliable, but also has more accurate temperature control.

This machine is designed for ultra-high temperature use environment, which can meet the soldering requirements of ultra-high temperature products.

Recipe and MES are available with this machine.

The patented sealing ring water-cooling structure, is not only durable and with lower usage costs, but also reduces expensive product damage caused by poor sealing.

The minimum void rate can reach Single<1%, Total<2%.