​Online Inspection System

• MEIX 3D Cube-XL Automated Optica

  MEIX 3D Cube-XL Automated Optical Inspection Rich algorithm, the combination of 3D, Al and color feature algorithms to optimize the detection rate of the defects.

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• MEIX 3D Cube-D Automated Optical

  MEIX 3D Cube-D Automated Optical Inspection Rich algorithm, the combination of 3D, Al and color feature algorithms to optimize the detection rate of the defects.

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• MEIX 3D Cube Automated Optical I

  MEIX 3D Cube Automated Optical Inspection Rich algorithm, the combination of 3D, Al and color feature algorithms to optimize the detection rate of the defects.

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• MEIX XL 3D AXI Automated 3D X-Ra

  MEIX inline XL 3D AXl is suitable for inline non-destructive inspection of SMT, DlP and lGBTsemiconductors. Covering BGA/LGA/CSP, SOP/QFP/QFN, Transistors, R/C-lGBT, Bottom Electrodes,Power Modules, POP, Connectors, THT Components and more.

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• MEIX 3D AXI Automated 3D X-RayIn

  MEIX inline 3D AXl is suitable for inline non-destructive inspection of SMT, DlP and lGBTsemiconductors. Covering BGA/LGA/CSP, SOP/QFP/QFN, Transistors, R/C-lGBT, Bottom Electrodes,Power Modules, POP, Connectors, THT Components and more.

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• MEIX 3D SPI-Icon-D Solder Paste

  MEIX 3D SPl - lcon-D series are suitable for 3D solder paste inspection after SMT screen printing.

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• MEIX 3D SPI-Icon Solder Paste In

  MEIX 3D SPl - lcon series are suitable for 3D solder paste inspection after SMT screen printing.

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