MEIX 3D SPl - lcon-D series are suitable for 3D solder paste inspection after SMT screen printing.

High accuracy: Intelligent zero reference point technology ensures accurate measurement, especially for PCB board deformation.

High performance: Perfect combination of 3D and Color-featured algorithm ensures effective detection on solder bridging, solder breakage, icicle, etc.

High speed: Flexible choices of multiple optical options, with industry-leading inspection speed and performance.

Strong Anti-jamming: Effective in detecting PCB with different colors variations. Automatically adjust inspection specifications for black and white boards.

Fast programming can be achieved with/without Gerber.

Process optimization: SPC data analysis helps to improve process quality.