Product

• MEIX 3D Cube-D Automated Optical

  MEIX 3D Cube-D Automated Optical Inspection Rich algorithm, the combination of 3D, Al and color feature algorithms to optimize the detection rate of the defects.

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• MEIX 3D Cube Automated Optical I

  MEIX 3D Cube Automated Optical Inspection Rich algorithm, the combination of 3D, Al and color feature algorithms to optimize the detection rate of the defects.

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• Vacuum Pressure Soldering Oven

  The machinc is designed for semiconductor, vacuum pressure soldering,dispensing and gluing voids.The machine adopts embedded system, not only stable & reliable, but has moreabundant and convenient communication interface.

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• Silver Paste Dust-free Oven

  The machine is used for soldering and sintering ofsemiconductor silver paste.The

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• MEIX HX-F1030L Vacuum Reflow Ove

  MEIX HX-F1030L Vacuum Reflow Oven This machine is a vacuum reflow soldering oven with independent intellectual property rights. It is suitable for vacuum SMT soldering of automobile headlights, aerospace, aviation, medical, automobiles, BGA, FPC, LED, etc.

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• MEIX HPK-300 Formic Acid Reflow

  MEIX HPK-300 Formic Acid Reflow Soldering Oven, This machine perfectly matches PINK vacuum reflow soldering, has independent intellectual property rights, and is designed for high-power modules such as semiconductor power devices and IGBT

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• MEIX XL 3D AXI Automated 3D X-Ra

  MEIX inline XL 3D AXl is suitable for inline non-destructive inspection of SMT, DlP and lGBTsemiconductors. Covering BGA/LGA/CSP, SOP/QFP/QFN, Transistors, R/C-lGBT, Bottom Electrodes,Power Modules, POP, Connectors, THT Components and more.

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• MEIX 3D AXI Automated 3D X-RayIn

  MEIX inline 3D AXl is suitable for inline non-destructive inspection of SMT, DlP and lGBTsemiconductors. Covering BGA/LGA/CSP, SOP/QFP/QFN, Transistors, R/C-lGBT, Bottom Electrodes,Power Modules, POP, Connectors, THT Components and more.

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• MEIX 3D SPI-Icon-D Solder Paste

  MEIX 3D SPl - lcon-D series are suitable for 3D solder paste inspection after SMT screen printing.

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• MEIX 3D SPI-Icon Solder Paste In

  MEIX 3D SPl - lcon series are suitable for 3D solder paste inspection after SMT screen printing.

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• MEIX HXM-1300 Vertical Curing Ov

  MEIX HXM-1300 Vertical Curing Oven This equipment is the vertical curing oven for semiconductor and SMT, turns horizontal heating to vertical one, with the advantages of saving energy, space.

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• MEIX HPK-400 Formic Acid Reflow

  MEIX HPK-400 Formic Acid Reflow Soldering Oven, This machine perfectly matches PINK vacuum reflow soldering, has independent intellectual property rights, and is designed for high-power modules such as semiconductor po

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