​Vacuum Reflow Die Bonding

• MEIX HSM-812VN Semiconductor Vac

  MEIX HSM-812VN Semiconductor Vacuum Oven, This equipment uses the imported platform, dedicatedly built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductor v

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• MEIX HSM-1012VNL Semiconductor V

  HSM-1012VNL Semiconductor Vacuum Oven, This equipment uses the imported platform, dedicatedly built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductor vacuum soldering equipment, specialized for SOP, SOT, DIP, QFN, QFP, BGA, IGBT, TO, MINI LED and other vac...

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• MEIX HSM-1012VN Semiconductor Va

  MEIX HSM-1012VN Semiconductor Vacuum Oven, This equipment uses the imported platform, dedicatedly built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductor

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• MEIX HSM-1013VNL Semiconductor V

  This equipment uses the imported platform, dedicatedly built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductor vacuum soldering equipment, specialized forSOP, SOT, DIP, QFN, QFP, BGA, IGBT, TO, MINI LED and other vacuum chip package soldering;

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