MEIX HXM/F-600 Vertical Curing Oven This equipment is the vertical curing oven for semiconductor and SMT, turns horizontal heating to vertical one, with the advantages of saving energy, space.

The equipment adopts embedded system, which is different from ordinary touch screen and industrial computer, not only stable & reliable, but also more convenient for communication interface.

Double temp. design, not only realize dual-temperature zone heating, but also one zone for heating and one for cooling.

The machine adopts a unique horizontal + up & down air, different from the traditional air module, can effectively prevent uneven hot air due to too many products.

Heating system adopts 3-level protection to effectively prevent overtemperature and damage to the product.

Machine is 10,000-level clean design, can be applied to any clean place.

Heating adopts intelligent PID fuzzy operation, heat compensation ability is stronger, lower energy consumption.