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Products Description
MEIX 3D Cube-D Automated Optical Inspection Rich algorithm, the combination of 3D, Al and color feature algorithms to optimize the detection rate of the defects.
Multiple positioning methods to locate the component precisely. Intelligently compensate for board warpage and detect defects on black components on black board.
Adapts to different color PCBs, effectively detect both black and white boards.
Marble platform, dual-drive plus motion control card ensure industry-leading inspection speed.
Ultra-high range 3D reconstruction technology, capable of measuring components up to 35mm height.
The powerful combination of three-point check software and SPC data analysis quickly identifies the root cause of defects.
| Camera | 12MP industrial camera |
| Resolution | 15ym,12um, 10μm |
| FOV | 60*45mm(12MP, 15μm) |
| Lighting | 4 color ring shape LED (RGBW) |
| Height Measurement Method | 4 way projectors |
| X/Y Movement | AC Servo (Dual drive) |
| Platform | Granite |
| Width Adjustment | Automatic |
| Transport Type | Belt |
| Board Loading Direction | Left to right or right to left (Select at point of order) |
| Fixed Rail | Single lane: 1st fixed rail; Dual lane: 1st rail (1st & 3rd fixed rail or 1st & 4th fixed rail) |
| Operating System | Win 10 |
| communication | Ethernet, SMEMA |
| Power Requirement | Single phase 220v, 50/60Hz,5A |
| Air Requirement | 0.4-0.6MPa |
| Conveyor Height | 900+20mm |
| Equipment Dimensions | L1140mm*D1360mm*H1620mm(Without tower light) |
| Equipment Weight | 1150kg |
| Size | Dual lane:50*60-510*320mm Single lane: 50*60-510*560mm |
| Thickness | s6.0mm |
| Warping | +3.0mm |
| Component clearance | Top clearance 25-50mm adjustable, Bottom clearance 45mm |
| Clamping Edge | 3.0mm |
| PCB Weight | s3.0kg |
| Component | Wrong Component, Missing, polarity, Shift, Reverse, Damage, ic Lead Bend, ic lifted Lead, Foreign Material, float, Coplanarity,. |
| Solder joint | Tombstone, etc. |
| Component Size | No Solder, insufficient Solder, Open Solder , Excess Solder, Solder Bridge, Solder Ball, etc.Chip: 03015 and above (3D); LSl: 0.3mm pitch and above; Others: Odd shape component |
| Measurable Range | 35mm(15μm) |
| Inspection Speed | 450ms/FOV |
