The machine is used for soldering and sintering ofsemiconductor silver paste.

The machine adopts embedded system, not only stable & reliable, but has moreabundantand convenient communication interface.

Recipe and MES are available with this machine.

Unique horizontal + vertical air convection, makes the temperature errorsmaller compared with traditional air module.

The equipment heating system adopts level 3 protection to effectively preventover-temperature damage to the product.

With 10,000 level clean design, can be applied to any clean place.

Heating system adopts intelligent PID calculation, heat compensation isstronger,withlower energy consumption.

The machine has nitrogen system and cooling system.