The machinc is designed for semiconductor, vacuum pressure soldering,dispensing and gluing voids.

The machine adopts embedded system, not only stable & reliable, but has moreabundant and convenient communication interface. 

Recipe and MES are available with this machine.

Unique horizontal + vertical air convection, makes the temperature errorsmaller compared with traditional air module. 

The cquipment heating system adopts level 3 protection to cffcctively preventover-temperature damage to the product.

With 10,000 level clean design, can be applied to any clean place.

Heating system adopts intelligent PlD calculation, hcat compensation isstronger, with lower energy consumption.

The machine has vacuum system and cooling system.