MEIX inline XL 3D AXl is suitable for inline non-destructive inspection of SMT, DlP and lGBTsemiconductors. Covering BGA/LGA/CSP, SOP/QFP/QFN, Transistors, R/C-lGBT, Bottom Electrodes,Power Modules, POP, Connectors, THT Components and more.

Features high-speed dynamic imaging, detection speed reaches 1.7 seconds/FOV.

Adaptively applies 7 projection styles and 7 resolution types to satisfy various usage scenarios.

Supports 3 seperate programming styles, one-touch value learning functionality and more.

The XY, YZ, XZ three-view interface makes diagnosing defects more intuitive.

Dual linear motors with grating rulers ensure precise positioning.

Models

3D AXI3D lmage ReconstructionDynamic image capture + circular multi-angle projection reconstruction technology

Resolution

8um,10um,15um,20um,25um,30umNumber of 3D Projections32,48,64,128,256,512,1024

X-Ray Tube

Microfocus X-ray sourcesX-Ray Tube Voltage/Current30-130KV,10-300μA

X-Ray Detector

CMOS Flat panel detectorX/Y MovementDual-drive linear motor with grating ruler feedback

Platform

GraniteWidth AdjustmentAutomatic

Board Loading Direction

Dual directionBoard ClampingAutomatic

Operating System

Win 10CommunicationEthernet, SMEMA

Power Requirement

Single phase 220v, 50/60Hz,16AAir Requirement0.5-0.6MPa

Conveyor Height

90020mmEquipment DimensionsL1835*D2110*H1715mm(Without tower light)

Equipment Weight

4280kgRadiationAllowable leakage < 0.5uSv/h

Size

100*50-750*610mmWarping3mm

PVB Weight

15kgComponent ClearanceTop clearance 80mm, Bottom clearance 40mm

Clamping Edge4.0mm

ComponentBGA/LGA/CSP, SOP/0FP/QFN, Transistor, R/C-lGBT, Bottom Electrode, Power Module, Pop, Connector, THT component and etc.

DefectsBubble, Open solder,lnsuficient solder, solder volume, Ofset, Bridging, solder climbing, THT solder fullfilment, solder Bar and etc.

Max. Layers400

Max. Speed1.7S/FOV